나노비즈코리아

• Process up to Five 4" (100mm) Wafers per Process Run 

• Touchscreen Programmable Interface 

• First Time Ever...Previous Run Data Review 

• Integrated Chiller Loop Decreases LCO2 Consumption 

• Easy Facilitation with Small Foot Print Design

tousimis catalog# 8788A 

⤓ Download Brochure (PDF) 

FEATURES




> A dedicated initial Slow Fill into the process chamber allows ideal fluid dynamics preserving the most sensitive micro devices.
> Maintenance made easy via accessible components including the external Post-Purge-Filter assembly.
> Patent Pending "Vortex Swirl": Non-mechanical stirring chamber allowing for fluid dynamic exchange without the need for particle generating friction causing devices.
> Extremely Efficient integrated Closed Cooling Loop dropping chamber temperature quickly for shorter process run times.
> The internal SOTER(tm) condenser quietly captures and separates CO2 exhaust and waste alcohols.
> Our original Chamber Inserts enable chamber I.D. variance of chamber I.D. maximizing efficiency in LCO2 consumption, process time, and providing multiple size wafer process capability!
> Process chamber LCO2 filtration down to 0.08µm with 99.999%+ particle retention.
> Processes up to five 4" (100mm) wafers each run. Included are the following HF Compatible Wafer Holders: 4" (100mm), 3" (75mm), 2" (50mm) and 10mm Die Holders.
> Chamber Illumination via viewing window facilitates chamber status visualization.
> Automatic process with factory default recipe or the ability to customize your own!
> All internal surfaces are inert to CO2 and ultrapure alcohols.

> Repeatable operating parameters insuring "reproducibility" of results.
> Safety operation features integrated into both temperature and pressure automatic regulation.
> All electronic components meet CE, UL and/or U.S. Military Specifications.
> Clean room static-free compatible design.