Vacuum transfering function
Heating chip +1100℃ and Biasing chip
Mel-Build’s solution chip Strong points
・The gap width is narrowed by sandwiching the insulating film.
・Superior measurement quality and SNR, in both AC and DC modes
・Less noise than general chips.
|Component||: Vacuum Transfer / Double Tilt / Biasing|
|Electrode||: 4 Electrodes|
|Resolution||: Less than 0.24nm (Guarantee spec.)|
|Tilt(JEOL)||: X = ± 15 degree , Y=± 12 degree @ HR PP|
|Tilt(TFS)||: X = ± 20 degree , Y=± 15 degree @ ST PP|
|Sample set||: Smart Set System|
|TEM||: JEOL PP type HR/FHP and Thermofisher|
|Include item||: Y tilt controller, Biasing controller, Software,Safety Operation Stand, and holder introduce.|
|*NOTE||: MEMS chip price is quoted on a case-by-case basis. (Not included MEMS chip cost)|